07
Sep
As AI data centers scale rapidly, Eaton is expanding beyond traditional power management into modular power deployment, next-generation DC conversion and liquid cooling, positioning itself to address infrastructure requirements from the electrical grid to AI chips.
07
Sep
Dark fab cybersecurity: Why autonomous manufacturing needs zero trust
AI-driven automation is reshaping the cybersecurity requirements of semiconductor manufacturing, with zero-trust architecture, trusted data, and interoperable standards becoming increasingly important as fabs move toward more autonomous operations.
07
Sep
China’s JCET seeks US$968M for AI-driven packaging expansion
JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity across high-performance computing (HPC), power modules, wafer-level packaging and memory, sharpening its exposure to AI infrastructure and China’s domestic semiconductor supply chain.
07
Sep
Orphans of the liquid cooling age: xMEMS targets data center ‘hot spots,’ eyes 2027 smartphone and smartglasses cooling ports
As the world’s most powerful enterprise data centers undergo a massive migration to liquid cooling to support high-power artificial intelligence processors, a Silicon Valley chipmaker is warning of a growing class of “thermal orphans”—localized, low-power components that are left out in the cold.
07
Sep
No foundry price relief before 2027 as utilisation nears 90%
AI demand is driving a broader repricing cycle across the foundry industry in 2026. Tightness that began at leading-edge nodes is spreading into mature and specialty processes, lifting wafer prices, utilisation and downstream chip costs.
07
Sep
Exclusive: DIGITIMES’ top 3 at K-Safety Expo 2026 shows where intelligent safety is heading — act ‘before’ disaster strikes
The most consequential safety technologies are often judged by what happens after something goes wrong: how fast an alarm sounds, how quickly rescuers arrive, or how effectively protective equipment limits injury.
07
Sep
AI racks move toward MW scale as power, cooling converge
As AI computing power surges, the energy consumption of AI servers has become a major bottleneck that must be solved. The issue is spreading from chips into power delivery systems as Nvidia’s AI racks ramp up, rapidly pushing up the power draw of a single AI rack.
07
Sep
AI is driving force behind ‘Moore’s Law on steroids,’ says Merck’s Benjamin Hein
AI is driving a new wave of technological demand and changing how the semiconductor industry innovates, according to Benjamin Hein, member of the executive board and CEO of the Electronics Business Sector at Merck. As AI becomes an integral part of semiconductor innovation, future competitive advantages in the industry will depend less on any single process or material, but rather on the ability to combine materials, processes, packaging, metrology, and software into complete processes. In this sense, AI-driven growth in the semiconductor industry is like “Moore’s Law on steroids,” and collaboration will become the industry’s next Moore’s Law.
07
Sep
Experts say subsidies can’t buy semiconductor competitiveness
At a forum jointly hosted by DSET and SEMI during SEMICON Taiwan this year, Glenn D. Tiffert of the Hoover Institution, Kioxia Holdings board member Emiko Higashi, and NRC reporter Marc Hijink offered views on national semiconductor policy from the perspectives of the US policy community, corporate boardrooms, and Europe’s industrial front line.
07
Sep
Pegatron, Deloitte Taiwan team up to speed smart manufacturing
Pegatron announced on September 3 that it had signed a memorandum of understanding with Deloitte Taiwan, combining Pegatron’s self-developed enterprise AI digital twin platform with Deloitte’s consulting expertise in AI strategy, governance, and implementation to offer corporate clients a one-stop AI solution from planning to deployment.