Samsung denies HBM3E price-cut rumors amid Nvidia approval delay

Samsung Electronics has secured an order from Tesla for artificial intelligence (AI) chips, offering a renewed boost to its foundry business. However, the company continues to face significant challenges in the memory sector, particularly in the high-bandwidth memory (HBM) segment, where it has yet to pass Nvidia’s quality tests, which could hinder its performance recovery.

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ASE challenges TSMC’s photonics play with CPO packaging push

At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst for innovation across the semiconductor sector. Advanced packaging technologies now face three critical challenges: increasing package size, escalating power consumption, and complex thermal management.

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TSC hits nearly 20% revenue increase from logic chip growth

Taiwan Specialty Chemicals (TSC), a subsidiary of Sino-American Silicon Products (SAS), is currently transforming from a specialty chemical supplier into an integrated advanced semiconductor process service provider. It posted a nearly 20% annual revenue increase in the first half of 2025, a product of the growth of advanced logic chip processes, delivering a solid performance despite a volatile environment.

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Nvidia pushes deeper into autonomous driving with AI-focused strategy

Artificial intelligence is reshaping the autonomous driving landscape, shifting the development paradigm from algorithm-driven systems to AI-centric architectures. At the forefront of this transformation is Nvidia, which has steadily evolved from a chipmaker into a comprehensive system solutions provider. In collaboration with global partners, the company is accelerating the commercial deployment of autonomous vehicles.

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