总投资90亿，莱宝高科MED项目最新进展
9月4日消息，莱宝高科发布最新投资者关系活动记录表。在记录表中，莱宝高科提到了MED项目的具体进展情况，包括厂房建设、设备订购和搬入以及资金使用、MED技术研发等。
04
Sep
04
Sep
富士康衡阳工厂宣布关停！
9月4日消息，鸿富锦精密工业（衡阳）有限公司于2025年8月28日发布通知，宣布因“市场环境影响，主要客户经营策略调整”，公司未来已无足够订单支撑运营，决定于2025年9月30日正式停止运营。
04
Sep
AR眼镜企业Rokid签约落户珠海
近日，国内AR眼镜领域头部企业——杭州灵伴科技有限公司（“Rokid”）正式签约落户珠海高新区。Rokid由珠海科技集团投资引进，计划入驻该集团旗下智谷圆芯产业园。
04
Sep
映日科技启动北交所IPO辅导
9月4日，证监会网站显示，芜湖映日科技股份有限公司(以下简称“映日科技”)在安徽证监局办理辅导备案登记，拟向不特定合格投资者公开发行股票并在北交所上市，辅导机构为中信建投证券。
04
Sep
美企提起337调查申请，多家整机厂为列名被告
9月4日消息，据中国贸易救济信息网，9月2日，美国BH Innovations LLC根据《美国1930年关税法》第337节规定向美国际贸易委员会提出申请，主张对美出口、在美进口及销售的特定液晶器件、组件及其下游产品违反了美国337条款。
04
Sep
17999元起！华为发布全球第二款商用三折叠手机
9月4日，继去年发布全球首款商用三折叠手机之后，在今日深圳举行的华为Mate XTs非凡大师及全场景新品发布会，华为推出全球第二款商用三折叠手机Mate XTs 非凡大师。华为Mate XTs 非凡大师将于发布当日开启预售，价格17999元起。
04
Sep
Dai Nippon Printing to open first overseas R&D center in the Netherlands, focused on co-packaged optics
Starting from September 2025, Japanese company Dai Nippon Printing (DNP) will launch its first research and development facility outside Japan, located in the High Tech Campus Eindhoven in the Netherlands. The new center will focus on advancing co-packaged optics (CPO) technology, aiming to accelerate innovation in photonic-electronic integration.
04
Sep
Nextlink buys Renova Cloud to enter Vietnam’s cloud market
Taiwan-based Far EasTone Telecommunications (FET) is strengthening its international and cloud strategy through its cloud business, Nextlink. FET has announced it has signed a 100% share acquisition agreement with Hong Kong-based cloud service technology firm Renova Cloud, through which FET will gain control of Renova Cloud’s subsidiary in Vietnam.
04
Sep
AMD, Anritsu partner to standardize high-speed testing for AI data centers
Japan’s Anritsu has teamed up with US chipmaker AMD to launch an automated testing platform for next-generation high-speed transmission, targeting the surging demand from AI data centers. The solution, called System Board Passive Channel (SBPC) Analysis Master, enables consistent validation across diverse devices and environments.
04
Sep
Research Insights: TSMC faces the next decade of chip war from Arizona to Beijing
Taiwan Semiconductor Manufacturing Co. (TSMC) has begun mass production and turned a profit at its Arizona plant in 2025, a milestone that marks not only a breakthrough in its global expansion but also a reversal of long-standing skepticism about America’s ability to sustain advanced chip manufacturing.