Brinno outlined time-lapse photography, visual AI, and defense imaging as its three core business pillars for 2026 at a spring banquet on March 20, saying the focus will accelerate R&D investment and growth through its global distributor network.

Tescan’s expansion of its Seoul site integrates a Demo Lab with office space to better serve semiconductor clients amid global AI-driven memory demand, promising faster failure analysis and reliability testing for advanced packaging customers worldwide and reducing testing wait times for partners pursuing heterogeneous integration and chiplet technologies.

The Shanghai AI Laboratory recently unveiled its DeepLink hybrid inference solution, emphasizing heterogeneous chip collaborative computing capabilities. This move marks a breakthrough in integrating China’s AI computing infrastructure and is seen as a localized alternative amid limited access to advanced GPUs and interconnect technologies.

Samsung Electronics’ labor union has voted overwhelmingly to initiate dispute proceedings following a breakdown in wage negotiations, raising concerns over potential disruptions to the supply of HBM4 memory for Nvidia’s next-generation AI accelerators.