02
Sep
As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech aims to address the challenge with advanced fluxless bonding tools, targeting the market for HBM4 and beyond.
02
Sep
As zombie startups become issue, TTA identifies three main entrepreneurial trends
Government agencies in Taiwan have taken measures to foster innovation and entrepreneurship in recent years, with the National Science and Technology Council (NSTC), Ministry of Economic Affairs (MOEA), and National Development Council (NDC) offering subsidies and guidance to foster more US$1 billion unicorns and accelerate industrial transformation into knowledge and applied services. Yet many of these startups have failed to rise out of the doldrums: even though their founders have vanished, these companies still exist in name only without being dissolved.
02
Sep
US-EU car spec deal puts Taiwan’s auto supply chain on edge
As trade talks between the Trump administration, the European Union, and Japan advance toward a “spec-for-tariff” arrangement, Taiwan faces growing uncertainty over its imported car market. The proposed scheme would allow US-spec vehicles to enter Europe and Japan without local specification restrictions and could eventually extend to Taiwan, raising questions about whether it would invigorate consumer demand or further strain the domestic automotive industry.
02
Sep
Taiwan’s 6G future hinges on spectrum policy as Nokia awaits regulatory direction
Sixth-generation wireless technology is expected to launch commercially around 2030, prompting global telecom operators to accelerate early preparations. Nokia has begun frequency band tests at its Finland headquarters, while Taiwan’s role remains uncertain. The company noted that Taiwan has not yet initiated related tests, and future participation will depend on how regulators position and allocate 6G spectrum.
02
Sep
China’s GPU startup Lisuan secures US$70 million as Dosilicon deepens stake, despite heavy losses
Dosilicon Co. has doubled down on Lisuan Technology, a Chinese GPU startup with no revenue but soaring investor attention. The Shanghai firm raised CNY500 million (US$70 million) in new funding, lifting its valuation to CNY4.21 billion.
01
Sep
Column: Modern computational methods transform semiconductor manufacturing landscape
Since 2000, semiconductor manufacturing has increasingly depended on advanced computational techniques, notably first principles calculations and machine learning, with quantum computing anticipated to join these efforts by 2025. These approaches, collectively described as computing semiconductors, play a critical role in research, development, and production processes across the industry.
01
Sep
China’s ICT push: embedding AI across smartphones, PCs, and wearables by 2026
The US has tightened controls on China’s semiconductor and artificial intelligence (AI) sectors under the banner of national security. Yet the surge of generative AI is reshaping industries worldwide, and Beijing is pressing ahead with its ambitions, especially in embedding AI into consumer and industrial devices.
01
Sep
South Korea’s display industry rebounds to US$10 billion in 1Q25, mixed outlook for 2H25
The Korea Display Industry Association (KDIA) reported that the combined revenue of South Korean panel companies reached US$10 billion in the first quarter of 2025, marking a return to the billion-dollar milestone after three years. This growth was primarily driven by increased demand for high-end OLED panels and customers placing early orders due to concerns over US tariffs.
01
Sep
Rapidus 2nm chip matches TSMC’s logic density, outpaces Intel in performance
Rapidus is preparing to launch its most advanced chip yet, a 2nm process called “2HP,” that could put it nearly on par with TSMC’s N2 node and significantly ahead of Intel’s 18A, according to Wccftech.
01
Sep
TPCA Show to kick off in October with Unimicron chair as keynote speaker
The technology supply chain will gather for a series of exhibitions in the second half of 2025, including Taiwan’s major PCB industry event, the TPCA Show, which will take place from October 22 to 24.