Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new entrant, CoWoP (Chip-on-Wafer-on-Platform PCB), has emerged as a potential disruptor to TSMC’s mainstream CoWoS packaging solution. Some industry observers believe CoWoP could reshape the PCB supply chain and even challenge CoPoS (Chip-on-Panel-on-Substrate), which has long been considered the most likely successor to CoWoS.

Broadcom-owned virtual cloud software giant VMware officially kicked off its annual Explore event in Las Vegas. In 2024, its AI developments were only discussed in interviews after the conference, but the company is aligning with the industry trend in 2025, with AI fully integrated into product design.

8月27日晚，星星科技(300256.SZ)公布2025年半年度报告，上半年公司实现营业收入7.06亿元，同比增长39.12%；归属于上市公司股东的净利润-936.19万元；归属于上市公司股东的扣除非经常性损益的净利润-5286.27万元；基本每股收益-0.0041元。

8月28日消息，据韩媒，有机构预测，三星显示、LGD、京东方预计将为下个月公开发布的苹果iphone17系列分别供应7800万台、4560万台、500万台OLED面板。