Nvidia’s CoWoP PCB architecture targets ABF substrates but faces warpage risk

Nvidia’s new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification. Key suppliers involved in early development include Taiwan’s Zhen Ding Technology Holding, Unimicron Technology Corp., and Compeq Manufacturing Co., along with China’s WUS Printed Circuit (Kunshan) Co. and Victory Giant Technology (HuiZhou) Co.

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The 7-year car loan becomes new standard in America

The traditional five-year auto loan is no longer the norm in the US. Driven by rising vehicle prices—fueled in part by tariffs on cars and auto parts—limited vehicle availability, and inflation reshaping consumer behavior, longer-term financing has become increasingly common. Six-year loans now dominate the market, while the share of seven-year loans is climbing at a record pace.

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Google AI overview feature prompts steep declines in media website traffic in UK

The rollout of Google’s AI summary function has sparked notable decreases in traffic for numerous media websites, raising concerns among publishers about a “Google Zero” era where users bypass clicking through to original sources. Industry participants are exploring strategies to counteract these impacts, according to the Financial Times and TechCrunch.

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Commentary: Trump eyes TSMC’s Arizona fab as leverage to lift Intel and ‘Made in America’ drive

Since August 11, 2025, when Intel CEO Lip-Bu Tan met with US President Donald Trump at the White House, and following the White House confirmation on August 22 that it would subsidize Intel through the CHIPS and Science Act in exchange for about a 10% equity stake, speculation has swirled around Trump’s special mission to save Intel and promote “Made in America.”

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