The rapid rise of artificial intelligence computing is transforming the server industry, pushing cooling demands past what traditional air-based systems can handle. As Nvidia chips drive power consumption beyond 1,000 watts, liquid cooling is no longer optional but essential. From water-to-water and water-to-air systems to full immersion cooling, the technology relies heavily on sensors and pumps. That reliance has created an opening for Taiwan’s FineTek and Walrus Pump to enter the AI server supply chain, even though neither company comes from an electronics background.

The era of 6G is approaching, with the integration of AI becoming a central focus. South Korea’s telecommunications industry emphasizes the interdependence between AI and networks: without intelligent networks, large-scale AI services cannot exist. However, many practical challenges remain to be overcome in implementation.

Toshiba’s semiconductor and electronic components subsidiary, Toshiba Electronic Devices & Storage, has reached a basic agreement with China’s silicon carbide (SiC) wafer manufacturer SICC for improving SiC wafer quality and technical cooperation. The two parties will also explore the possibility of expanding SiC wafer supply in the future and continue negotiating specific collaboration details.