Mercedes-Benz Taiwan launches new CLA with Nvidia’s Alpamayo platform, readies EV push

Mercedes-Benz Taiwan has officially unveiled the all-new CLA series — the first mass-produced model built on the Mercedes-Benz Modular Architecture (MMA) platform, as announced by company president Mark Raine. Priced from NT$1.87 million (US$58,600), the CLA is aimed at mainstream consumers, with both electric and gasoline variants sharing the same starting price.

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Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity

Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity to internal production, according to Hankyung and industry sources. The move underscores the South Korean chipmaker’s drive to meet surging demand for artificial intelligence (AI) components as orders from major customers — including Nvidia and Advanced Micro Devices (AMD) — continue to accelerate.

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Lumotive makes optical breakthrough, targets 10,000-port data centers

As Nvidia and Coherent signal a shift toward all-optical networking to solve the AI power crisis, Redmond-based Lumotive has announced a milestone that could redefine data center scalability. In an interview with DIGITIMES Asia, Gleb Akselrod, Co-founder and CTO of Lumotive, detailed the success of the world’s first programmable 2D optical beamforming chip.

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HiSilicon unveils self-developed CIS chip, shaking global sensor supply chain

The global CMOS image sensor (CIS) supply chain faces a major disruption as HiSilicon, Huawei’s core semiconductor subsidiary, officially enters the high-end CIS market with its first self-developed sensor chip. Partnering with strategic collaborator Gkuvision, an imaging solution provider, HiSilicon launched the new generation sports camera “Xiaotu S7PRO MAX” equipped with its proprietary sensor.

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