Advanced packaging boom propels ASE, KYEC through shifting semiconductor landscape

Even as Taiwan’s semiconductor tariff policies remain unresolved and the New Taiwan dollar continues to appreciate, major chip packaging and testing firms are showing surprising resilience. Strong demand for high-performance computing (HPC) chips—driven by the global boom in artificial intelligence (AI)—is helping Taiwan’s outsourced semiconductor assembly and test (OSAT) giants maintain steady growth into the second half of 2025.

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TSMC 2Q25 profit surges 60.7% on robust demand for 3nm, 5nm chips

Taiwan Semiconductor Manufacturing Company (TSMC) posted strong second-quarter results, with profit soaring 60.7% year-over-year to NT$398.27 billion (US$12.59 billion), driven by high demand for its advanced 3nm and 5nm chip technologies. Revenue climbed 38.6% to NT$933.79 billion, marking continued momentum in high-performance computing and smartphone markets.

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Taiwan pushes for sub-25% US tariff, citing strong strategic contributions

As the US recalibrates its tariff rates for global trade partners, Taiwan is striving to secure a rate below 25%, arguing that its economic and strategic contributions rival or even surpass those of other nations. Brazil is facing a sharp increase in tariffs to 50%, while Japan and South Korea have been set at 25%. Taiwan’s tariff rate, however, has yet to be announced.

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China accelerates RISC-V localization with new Shanghai research hub

China is ramping up its RISC-V ambitions with the launch of the Shanghai Open Source Computing Research Institute, unveiled at the 5th RISC-V Summit China on July 17, 2025. As the country’s second key platform, following the Beijing Open Source Silicon Innovation Center, the institute aims to strengthen domestic innovation in open instruction set architecture (ISA) development.

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