Advanced packaging boom propels ASE, KYEC through shifting semiconductor landscape
Even as Taiwan’s semiconductor tariff policies remain unresolved and the New Taiwan dollar continues to appreciate, major chip packaging and testing firms are showing surprising resilience. Strong demand for high-performance computing (HPC) chips—driven by the global boom in artificial intelligence (AI)—is helping Taiwan’s outsourced semiconductor assembly and test (OSAT) giants maintain steady growth into the second half of 2025.
TSMC 2Q25 profit surges 60.7% on robust demand for 3nm, 5nm chips
Polarizer makers face mounting cost pressures as PET shortages persist
Taiwan’s Hsuan Yuan Tech eyes US, Europe expansion as drone demand shifts to components
Taiwan Cement’s battery unit starts insurance claims after plant fire
Import tariff talks with the US spark fears among Taiwan’s domestic carmakers
Taiwan pushes for sub-25% US tariff, citing strong strategic contributions
China accelerates RISC-V localization with new Shanghai research hub
China is ramping up its RISC-V ambitions with the launch of the Shanghai Open Source Computing Research Institute, unveiled at the 5th RISC-V Summit China on July 17, 2025. As the country’s second key platform, following the Beijing Open Source Silicon Innovation Center, the institute aims to strengthen domestic innovation in open instruction set architecture (ISA) development.