NIAR launches chip-level advanced packaging platform to boost Taiwan’s semiconductor edge

As the global semiconductor industry enters the post-Moore’s Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has become a critical technology shaping technological competitiveness and industrial layout. On January 13, 2026, Taiwan’s National Institutes of Applied Research (NIAR) unveiled its chip-level advanced packaging R&D platform.

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Samsung DS rebounds to record KRW20 trillion under new leadership

Samsung Electronics Vice Chairman Jun Young-hyun, since his appointment in May 2024, has spearheaded significant changes at the company’s Device Solutions (DS) division, reversing the company’s decline in high-bandwidth memory (HBM) technology. Samsung’s semiconductor business, once trailing behind Korean rival SK Hynix, has regained competitiveness amid rising AI demand, according to reports from JoongAng Daily and The Korea Times.

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US rollback on Chinese drone ban to only have limited influence on Taiwan IPC sector

The US Department of Commerce recently revoked restrictions imposed by the Federal Communications Commission (FCC) in late December 2025 that banned imports of new drones and components from Chinese manufacturers, including DJI and Autel Robotics, due to national security concerns. This reversal complicates earlier assumptions that Taiwanese suppliers would gain significantly from displaced orders. However, industry experts suggest the impact on Taiwan’s industrial PC (IPC) sector may be limited.

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