Research Insight: System-level design, energy efficiency, and TCO drive AI hardware competition

AMD introduced its Helios system platform at CES 2026, marking a significant move in cloud AI computing competition from traditional single-chip performance to full rack-scale solutions. This development follows Nvidia’s GB200 NVL series release and Google’s TPU-based rack product plans disclosed by Broadcom, underscoring an industry trend toward delivering computing power through integrated system platforms rather than isolated chips.

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Packaging and testing cluster expected to emerge as TSMC Arizona GigaFab expands

During TSMC’s first earnings call of 2026, CEO C.C. Wei said that key metrics at its Arizona fabs are approaching the level of advanced manufacturing in Taiwan. Rising demand from US-based AI customers supports TSMC’s capacity expansion in the US, prompting back-end packaging and testing supply chain partners to consider expanding their US presence.

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