Micron’s new fabs target 2030 rollout as supply shortages linger
Micron is scheduled to begin construction on its planned New York state megafab site on January 16, 2026, advancing its US manufacturing expansion even as executives warn that new capacity will take years to meaningfully ease tight conditions in the global memory market.
Research Insight: System-level design, energy efficiency, and TCO drive AI hardware competition
TSMC sees memory price hikes unlikely to curb demand as Apple and Samsung adapt
Yageo secures full voting control of Shibaura Electronics after Tokyo delisting
Taiwan-based passive component maker Yageo said Japan’s Shibaura Electronics was officially delisted from the Tokyo Stock Exchange on January 13. Following the completion of the share consolidation, Yageo now holds 100% of the voting rights in Shibaura Electronics as of January 15.
Canon eyes 2027 inkjet wafer planarization launch
Canon said on January 13 that it has developed a new wafer planarization technology designed to uniformly smooth surface irregularities during semiconductor manufacturing. The process applies resin materials using inkjet printing and then presses a glass plate onto the surface, using a stamping-like method to achieve planarization.
Apple’s LCD demand gives Radiant room to expand into AR and OLED
In Jodi Shelton’s new podcast, Jensen Huang says Nvidia was forged by suffering
In the inaugural episode of a new leadership podcast, Jensen Huang offers a strikingly unvarnished account of how Nvidia became one of the world’s most valuable technology firms.