InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC’s Face-to-Face (F2F) SoIC technology, fully compliant with the UCIe 2.0 (Universal Chiplet Interconnect Express) standard. This marks a significant achievement for high-speed interconnect capability for heterogeneous integrated chips.

OpenAI has diversified its cloud infrastructure beyond Microsoft Corp. to include Google Cloud, CoreWeave Inc., and Oracle Corp., underscoring the intensifying competition for scarce AI computing resources that has left multiple providers reporting capacity constraints in early 2025.

中小尺寸面板厂凌巨昨（17）日表示，夺下全球重量级睡眠呼吸器品牌的2.4吋显示器模组大单。