17
Jul
Wingtech Technology announced on July 15 a sweeping leadership overhaul as it shifts its core strategy toward semiconductors, following the divestiture of its consumer electronics ODM business. In March 2025, under mounting US sanctions, Wingtech sold its entire ODM manufacturing unit to Luxshare Precision, marking a complete exit from the consumer electronics sector and a decisive pivot to semiconductor development.
17
Jul
Siemens eyes Samsung’s IP weak spot—could it unsettle the Synopsys-Cadence duopoly?
In a strategic move to disrupt the duopoly of Synopsys and Cadence in the electronic design automation (EDA) market, Siemens is reportedly launching an intellectual property (IP) alliance aimed at advancing its position. The initiative specifically targets major players like Samsung Electronics.
17
Jul
Gigabyte GS27FC2 is a 240Hz SuperSpeed VA gaming monitor
17
Jul
What killed China’s rising 5G chip hopeful? The untold collapse of Jian Wen Lu Semiconductor
Founded in 2016 by former Tokyo Seimitsu (Accretech) engineer Sheng Jinghao, Jian Wen Lu (Zhejiang) Semiconductor was once considered a standout contender in China’s push for 5G RF chip independence. Its mission: to bypass foreign patent restrictions and develop high-frequency filters, long viewed as a chokepoint in RF front-end design.
17
Jul
Can GlobalFoundries’ MIPS move chip away at Arm’s edge AI dominance?
While Intel’s new CEO Lip-Bu Tan is still pondering how to find a path forward for its foundry business, US-based semiconductor foundry giant GlobalFoundries (GF) recently announced plans to acquire chip developer MIPS Technologies at an undisclosed price and enter the RISC-V processor market.
17
Jul
Malaysia’s states compete to lead national push in IC design
Malaysia is ramping up efforts to grow its domestic integrated circuit (IC) design industry, as key states such as Selangor, Sarawak, and Penang launch competing initiatives to position themselves as the country’s next semiconductor innovation hub.
16
Jul
LG enters hybrid bonding tool race, challenging Samsung and Hanwha
LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory (HBM) chips. Often described by industry insiders as the “dream tool” for future memory packaging, HB systems are seen as essential to boosting performance in AI and data-intensive applications.
16
Jul
Geely’s US$2.4 billion Zeekr buyout kickstarts China’s EV brand consolidation wave
Geely Automobile Holdings Limited has agreed to fully acquire Zeekr, its high-end electric vehicle brand, in a US$2.4 billion deal aimed at consolidating operations and sharpening global competitiveness in the smart EV segment. The transaction will privatize Zeekr and delist it from the New York Stock Exchange by the fourth quarter of 2025.
16
Jul
China restricts cathode material technology exports; LMFP becomes strategic resource, says HCM
Leading battery cathode material manufacturer HCM announced that China’s Ministry of Commerce has officially imposed export restrictions on “battery cathode material preparation technology.” HCM is actively establishing a demonstration production line for lithium manganese iron phosphate (LMFP), highlighting Taiwan’s increasingly important role in energy autonomy policy.
16
Jul
Copper shock: auto industry faces cost surge under new tariff
President Donald Trump’s latest tariff announcement — a proposed 50% duty on copper imports to take effect in August — is sending shockwaves through the American auto industry, which is already strained by rising material costs. Industry analysts warn the move could trigger a fresh wave of price increases for vehicles, as financial pressures ripple down through the supply chain.