Broadcom unveils third-gen CPO technology to power AI’s next leap

Semiconductor giant Broadcom has introduced the third generation of its co-packaged optics (CPO) technology, significantly advancing the capabilities of high-speed data transmission critical to artificial intelligence (AI) infrastructure. The new solution doubles the transmission speed to 200 Gbps per lane, while dramatically improving energy efficiency and cost.

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Computex 2025: Supermicro pushes AI growth and efficiency amid ongoing Nvidia chip shortage

During his keynote speech at Computex 2025, Supermicro president and CEO Charles Liang once again pressed Nvidia CEO Jensen Huang for faster product deliveries. Huang joked that every time he appears on stage, Liang asks him for shipments. According to industry sources, even with expanded capacity, Nvidia’s Blackwell chips remain in short supply.

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AI agent race heats up: cross-system integration and standardization key to widespread adoption

In a keynote on May 19, 2025, Nvidia CEO Jensen Huang focused on AI infrastructure, AI agents, and physical AI (robots). He highlighted that AI agents require significantly more computing power than one-shot AI. While cloud providers have launched AI agent services, the key challenge for widespread adoption is achieving cross-system integration and standardization.

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Samsung enters crisis mode: TV market lead under threat as TCL CSOT, Hisense close in

Samsung Electronics’ Visual Display (VD) Business has reportedly entered “emergency management” mode in response to falling global TV market share and rising LCD panel costs—two critical factors driving the company’s internal shakeup. According to The Korea Economic Daily, Yonhap News Agency, and Korea Daily News, Yong Seok-woo, President and Head of the VD Business, recently told executives the division would adopt tighter operational policies as part of a broader crisis response strategy.

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TSMC supplier AEMC ramps up in Taiwan, defers US plans until post-2030

TSMC is fast-tracking its capacity expansion with plans to build nine new facilities in 2025, including eight wafer fabs and one advanced packaging plant. The move has energized sentiment across its supply chain. Advanced Echem Materials Company (AEMC) Chairman Chan Wen-hsiung said the firm had already anticipated this expansion, citing new capacity at its Tainan and Kaohsiung facilities as sufficient to support customer needs through 2030. A US plant is not under consideration before then and would only be evaluated after that timeline.

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Huawei unveils HarmonyOS PCs: foldable design, full-stack control, cross-device ecosystem

Huawei, on May 19, 2025, launched its first personal computers powered by HarmonyOS, after five years of development involving more than 10,000 engineers. The MateBook Pro and MateBook Fold Ultimate Design are the first laptops to run HarmonyOS 5, marking a pivotal moment in China’s drive for full-stack operating system autonomy in the PC sector.

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Quantum computing enters ‘noisy’ phase: tech leaders diverge on timelines and expectations

Tech giants are investing in quantum computing, with Nvidia CEO Jensen Huang anticipating that future supercomputers will include quantum accelerators. He noted current challenges with “noise” in the industry. Similarly, Alphabet and Google CEO Sundar Pichai expressed concerns about noise, suggesting practical quantum computers could be five years away.

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