Tariffs impact economy, but AI servers remain an exception, says Wistron

Wistron president and CEO Jeff Lin stated that AI servers represent a rigid demand and are not affected by reciprocal tariffs. However, mature consumer products such as notebooks and smartphones are likely to face challenges due to tariff impacts. Lin also revealed that in response to the US reciprocal tariffs, Wistron has prepared multiple contingency plans labeled Plan A, B, C, D, and E, although details of the tariffs remain unclear and customers have yet to provide definitive instructions.

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Intel cuts jobs at Israel’s Fab 28 as new CEO rethinks global footprint

Intel has initiated job cuts at its Fab 28 wafer fabrication plant in Kiryat Gat, Israel, marking the first time the facility—one of the chipmaker’s three largest global manufacturing hubs—has been affected by broader company-wide downsizing. The move comes as new CEO Lip-Bu Tan accelerates efforts to streamline Intel’s sprawling global operations and eliminate organizational inefficiencies.

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Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation for next-generation HBM4 and NAND flash memory exceeding 400 layers, SK Hynix is reportedly preparing to overhaul its wafer dicing technologies — a foundational step in semiconductor production that is becoming increasingly difficult due to thinning wafers.

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Smartphone brands expand AI adoption to mid-to-high-end models to boost sales in 2H25

As the third quarter of 2025 kicks off, smartphone brands around the world are rolling out new models, hoping to rejuvenate the sluggish market as inflation, currency swings, and trade tensions continue to weigh on consumer demand. While the smartphone market continues to face challenges like product maturity, high market penetration, and extended replacement cycles, making it difficult to achieve strong overall sales momentum, it’s fortunate that generative AI has boosted the industry in recent years. Brands have progressively incorporated AI functionalities into their mid- and high-end models, which has helped sustain smartphone sales.

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Kioxia, YMTC jump ahead with wafer-bonded NAND in volume production

Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, respectively — for next-generation NAND flash memory production. This strategic shift moves the industry beyond the traditional race to increase memory cell layer counts, focusing instead on architectural advances that improve performance, power efficiency, and scalability.

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Taiwan must move beyond OEM/ODM to export complete systems, particularly aging-related technology, says NSTC Minister

Taiwan must move beyond its traditional OEM (original equipment manufacturing) and ODM (original design manufacturing) model and focus on exporting complete systems, particularly in the rapidly growing aging-related technology sector, according to National Science and Technology Council (NSTC) Minister Cheng-wen Wu.

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Industry calls for delay as EU’s AI crackdown begins

The EU has released the Code of Practice (“Code”) for General-Purpose AI Models (GPAI), a preparatory measure for the AI Act set to take effect on August 2, 2025. The Code aims to guide companies in complying with the upcoming regulations. However, the timeline is tight, and the industry is calling for a delay in enforcement, claiming that the preparation time is insufficient.

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