重磅！TCL华星MLED项目COB直显产品量产下线
8月7日消息，据“TCL华星”，近日，TCL华星在苏州基地成功举行MLED项目COB直显产品量产仪式，同时，TCL华星首款Mini LED产品——P1.2 COB显示屏正式实现量产下线。这一里程碑时刻，标志着TCL华星在MLED显示技术产业化进程中取得关键突破，推动行业迈入全新阶段。
07
Aug
07
Aug
集创北方欲二度闯关科创板，启动上市辅导！
8月5日，证监会官网显示，集创北方启动上市辅导，拟首次公开发行股票并在科创板上市，辅导机构为中信建投证券股份有限公司。
07
Aug
J-Star Holding lists on Nasdaq, aims to be pioneer for Taiwan’s SMEs
J-Star Holding, known as YMA, was listed on the Nasdaq Stock Market on July 29, 2025. Chairman Jonathan Chiang noted that this marks a significant milestone for the company, aiming to inspire Taiwanese SMEs by highlighting opportunities beyond the Asian market.
07
Aug
Zettabyte secures strategic investment from Lam Research to expand global AI data center footprint
Zettabyte, an AI data center service provider, has secured a strategic investment from Lam Capital, part of Lam Research Corporation. The funding round also saw involvement from Taiwanese firms Foxconn, Pegatron Corp., and Wistron Group, aiding Zettabyte’s global market expansion. The investment amount remains undisclosed.
07
Aug
Can Microsoft sustain US$4 trillion valuation amid AI uncertainty and OpenAI tensions?
Microsoft’s market capitalization surged past US$4 trillion following its latest earnings release. While the company exceeded revenue expectations, significant challenges persist, including strained relations with OpenAI and less advanced AI innovations relative to competitors, raising questions about the sustainability of its valuation.
07
Aug
Huawei open-sources CANN to challenge Nvidia’s CUDA dominance
Huawei plans to open-source its Compute Architecture for Neural Networks (CANN), a heterogeneous AI computing framework positioned as a direct alternative to Nvidia’s dominant CUDA platform.
07
Aug
Samsung denies HBM3E price-cut rumors amid Nvidia approval delay
Samsung Electronics has secured an order from Tesla for artificial intelligence (AI) chips, offering a renewed boost to its foundry business. However, the company continues to face significant challenges in the memory sector, particularly in the high-bandwidth memory (HBM) segment, where it has yet to pass Nvidia’s quality tests, which could hinder its performance recovery.
07
Aug
ASE challenges TSMC’s photonics play with CPO packaging push
At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst for innovation across the semiconductor sector. Advanced packaging technologies now face three critical challenges: increasing package size, escalating power consumption, and complex thermal management.
07
Aug
TSC hits nearly 20% revenue increase from logic chip growth
Taiwan Specialty Chemicals (TSC), a subsidiary of Sino-American Silicon Products (SAS), is currently transforming from a specialty chemical supplier into an integrated advanced semiconductor process service provider. It posted a nearly 20% annual revenue increase in the first half of 2025, a product of the growth of advanced logic chip processes, delivering a solid performance despite a volatile environment.
07
Aug
Nvidia pushes deeper into autonomous driving with AI-focused strategy
Artificial intelligence is reshaping the autonomous driving landscape, shifting the development paradigm from algorithm-driven systems to AI-centric architectures. At the forefront of this transformation is Nvidia, which has steadily evolved from a chipmaker into a comprehensive system solutions provider. In collaboration with global partners, the company is accelerating the commercial deployment of autonomous vehicles.