TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute density, high-bandwidth connectivity, power efficiency, and thermal management. Ray Wan, director of Asia-Pacific business, said TSMC will leverage advanced process technology and advanced packaging to help customers accelerate innovation in the AI era.

Google announced Gemini Intelligence in the US on May 13, further integrating Gemini’s AI capabilities into Android. The move pushes Android from a traditional operating system toward a “smart system,” but in China, local AI ecosystems leave little room for Gemini Intelligence to gain traction.

Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and high-bandwidth memory (HBM) competitiveness. The move signals a shift from catch-up mode back toward longer-term technology investment.