元太、Oricom共同推出彩色电子纸广告牌
6月26日消息，全球电子纸领导厂商E Ink元太科技与日本Oricom公司24日宣布共同研发出搭载元太科技最新彩色电子纸技术E Ink Spectra™ 6的新世代广告显示广告牌”Sustainable Board”（可持续广告牌）。
26
Jun
26
Jun
维信诺拟购买资产并募资不超过16.39亿元
6月25日，维信诺（002387）公告，计划通过发行股份及支付现金的方式购买合肥合屏投资有限公司、合肥芯屏产业投资基金（有限合伙）以及合肥兴融投资有限公司持有的合肥维信诺科技有限公司40.91%股权，交易金额为609,757.2344万元。
26
Jun
消息称TCL华星首个OLED显示器面板已经开始投产
6月25日消息，据行业消息源视讯堂的消息，TCL华星的首个OLED显示器面板已经开始投产，部分显示器品牌开始对基于华星面板的OLED显示器样机进行测试，未来有望打破韩企在该领域双头垄断的局面。
26
Jun
浙江杭州：首次运用AR智能眼镜开展电力巡检
6月26日消息，据经济参考报，近日，国网杭州供电公司在杭州临平勤学开关站首次运用AR技术，对一、二次保护设备进行巡视检查，成功实现省内首次AR智能眼镜与电力巡检的深度融合。这一成果标志着国网杭州供电公司在临平区域推进电力巡检模式革新、服务地方经济发展的战略布局中取得重大突破。
26
Jun
消息称三星显示和LGD已开始为苹果M5 iPad Pro量产OLED面板
6月26日消息，科技媒体ZDNet Korea昨日（6月25日）发文称，三星显示（Samsung Display）和LG Display已开始为苹果M5 iPad Pro量产OLED面板。
26
Jun
Sysgration boosts investment in Celxpert; IPC and BBU shipments to start in 2H25
Strategic investments and collaborations have become the norm in the information and communications technology industry, aiming to expand product offerings and market reach while creating mutual benefits. Sysgration, originally focused on tire pressure monitoring system (TPMS) products, has actively broadened its market scope in recent years. The company has ventured into industrial PC (IPC) and energy-related product sectors and strengthened its product and market positioning through investments.
26
Jun
Chinese chip giants multiplying subsidiaries in race for supply chain control
Amid rising US-China tech tensions and growing supply chain risks, China’s top semiconductor companies are rapidly forming new subsidiaries to strengthen control over their supply chains and accelerate domestic self-sufficiency. Major players like SMIC, JCET, and Huawei have recently launched a wave of new ventures across chip design, fabrication, materials, and packaging. The initiative reflects a coordinated effort to build a more resilient and self-contained domestic tech ecosystem.
26
Jun
ASE’s COO bets on Taiwan’s AI strength, calls TSMC’s U.S. push decisive
Tien Wu, chief operating officer of ASE Technology, said the company has no plans to revise its full-year capital spending despite mounting geopolitical tensions and tariff pressures that are disrupting the global semiconductor supply chain. While the group is making strategic adjustments to its international footprint, Wu expressed confidence in the continued expansion of the AI market and reaffirmed ASE’s commitment to ramping up capacity in advanced packaging and testing.
26
Jun
SK Hynix expands DRAM dominance with new chip packaging plant in South Korea
SK Hynix said it plans to construct a new semiconductor backend facility in Cheongju, North Chungcheong Province, marking its seventh such plant in South Korea, as the company moves to expand production capacity and strengthen its position in high-performance memory packaging.
26
Jun
ASE group Chair’s daughter joins board, fuels succession rumors
ASE Technology Holding Co., the world’s largest provider of semiconductor packaging and testing services, convened its annual shareholders’ meeting on June 25, 2025, approving key financial documents and executing a notable board reshuffle that may signal the company’s future leadership path.