As the four major cloud service providers (CSPs) actively invest in self-developed application-specific integrated circuits (ASICs), market forecasts predict a rapid increase in shipments in 2025. However, the integrated circuit substrate supply chain has indicated concerns over potential upstream material shortages following reports that Japan’s leading fiberglass cloth manufacturer Nittobo is facing high-end production capacity constraints. This could potentially hinder future server shipments.
Taiwan continues to dominate the global outsourced semiconductor assembly and test (OSAT) market, but China is catching up quickly. Driven by state-backed chip self-reliance efforts, China’s OSAT industry has expanded at pace, steadily closing the market share gap across the Taiwan Strait. A recent industry-led initiative gaining traction in China is also pushing back against cutthroat pricing that has undermined profitability.
Taiwan-based Auden Techno Corp., a leading provider of radio frequency (RF) antenna solutions, broke ground on a new manufacturing facility in Vietnam’s Hải Dương Province on July 21, 2025, underscoring the company’s efforts to expand global production capacity and reinforce its international supply chain resilience.
Samsung Electronics is preparing a strategic challenge to SK Hynix’s dominance in sixth-generation high-bandwidth memory with an ambitious technological leap that could reshape the HBM4 supply landscape.
Apple is currently facing turbulent times, with mounting market criticism focusing on its lack of product innovation, lagging development in generative AI (GenAI), and executive personnel changes. As these issues come to light, discussions have emerged about whether Apple should consider appointing a new CEO to replace Tim Cook.
AWS has confirmed that its last overseas research institute, located in Shanghai, has officially disbanded, stating that this organizational adjustment aligns with the company’s future strategic direction and resource allocation.
Samsung has reported strong pre-orders in Taiwan for its latest Galaxy Z7 series, with the vendor assessing the feasibility of bringing its trifold devices to the Taiwanese market when they are released at the end of the year at the earliest.
Ørsted announced that the first turbine of the Greater Changhua 2b and 4 offshore wind farms has successfully connected to Taipower’s grid and begun generating electricity. This 920 MW project represents a groundbreaking achievement as the world’s first offshore wind farm specifically designed to supply green electricity to TSMC.
Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging. Testing is underway, with commercialization dependent on market demand and investment viability.