TSMC’s tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI accelerators.

China’s generative AI sector is seeing another wave of aggressive fundraising, with leading large language model (LLM) developers rapidly securing capital while expanding ties with consumer electronics and device ecosystems.

Samsung Electronics’ escalating labor dispute has sparked global supply-chain concerns, with Apple and HP said to be warning they could exit the company’s ecosystem. Suppliers, industry groups, and clients are now assessing contingency measures as mediation resumes, with potentially wide-ranging implications for production schedules, procurement stability, investor confidence, and the wider technology hardware market at large.