京东方旗下成都智慧科技公司增资至30亿 增幅500%
6月11日消息，天眼查App显示，近日，成都京东方智慧科技有限公司发生工商变更，注册资本由5亿人民币增至30亿人民币，增幅500%。
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Jun
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Jun
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Jun
总投资20.2亿！京东方越南智慧终端二期项目提前量产
6月10日，BOE（京东方）越南智慧终端二期项目量产暨客户交付仪式在越南巴地头顿省富美市成功举办。作为京东方首个海外自主投建的智慧工厂，越南二期项目比原计划提前两个半月量产，以先进的运营管理经验再次彰显“BOE速度”。
11
Jun
京东方A：发行不超过20亿元科技创新公司债券
6月10日，京东方A公告，发行人面向专业投资者发行面值不超过100亿元的公司债券已于2024年9月25日获得中国证监会注册批复。
10
Jun
YMTC sues Micron over ‘spyware’ allegations amid ongoing patent, IP battles
Chinese memory chipmaker Yangtze Memory Technologies Co. (YMTC) has filed a federal lawsuit in Washington, DC, accusing US-based Micron Technology of launching a disinformation campaign that falsely characterizes YMTC’s chips as spyware-laden and a threat to national security.
10
Jun
MSI to ramp AI server shipment in 2H25; US plant to begin operation in 3Q25
Micro-Star International (MSI) held its annual shareholders’ meeting on June 10, 2025, with chairman Joseph Hsu outlining cautious optimism for 2025 despite lingering global and operational challenges. Hsu acknowledged that 2024 was a difficult year due to delayed product launches and geopolitical and economic headwinds. Nonetheless, MSI continued investing in key areas such as AI, high-performance computing (HPC), automotive electronics, and charging infrastructure. The company projected a return to growth beginning in the second half of 2025, bolstered by recovering demand for gaming products.
10
Jun
San Fu unveils seven strategies to ride semiconductor wave and expand overseas
Taiwan-based San Fu Chemical unveiled a broad seven-point strategic roadmap at its annual shareholder meeting on June 9, 2025, signaling the company’s intent to deepen its footprint in the semiconductor sector and expand its global presence, particularly in Vietnam.
10
Jun
Huawei ramps up in-house tech with foldable PC, Pura 80 smartphone to challenge Apple
Amid intensifying US-China tech rivalry and deepening supply chain fragmentation, Huawei is mounting a formidable response through a series of proprietary technologies and product launches, signaling its comprehensive breakthroughs in chip design, system integration, and hardware engineering.
10
Jun
WWDC 2025: Cosmetic upgrades, but AI questions linger
Apple’s Worldwide Developers Conference (WWDC) 2025, held on June 9, marked the debut of a new design language called “Liquid Glass” and introduced updates across its software platforms, including iOS 26, macOS Tahoe, watchOS 26, Vision OS 26, and iPadOS 26. Despite these enhancements—ranging from a dynamic, translucent user interface to new productivity tools—analyst reactions have been mixed, with many questioning the company’s direction in artificial intelligence (AI).
10
Jun
Tariffs, currency swings, and inventory risks weigh on Taiwan’s IC sector outlook
After a front-loaded surge in shipments driven by tariff fears and early stockpiling, Taiwan’s IC distributors are facing a much more uncertain second half of 2025. A cocktail of trade policy volatility, currency appreciation, and inventory overhang has led many firms to issue cautious outlooks for the remainder of the year.