25
Mar
25
Mar
Chunghwa Telecom partners with global carriers to build Pacific submarine cable
Chunghwa Telecom announced it will join forces with SK Broadband, SoftBank, and Verizon to construct a new 12,500-kilometer submarine fiber optic cable system called “E2A” connecting Asia and North America. The initiative responds to surging demand for high-capacity, low-latency infrastructure driven by AI, cloud computing, and next-generation mobile networks.
25
Mar
Computex 2025: 1,400 exhibitors gather in Taipei
Computex 2025 is set to take place from May 20 to May 23 at the Taipei Nangang Exhibition Center. The Taiwan External Trade Development Council (TAITRA) has announced that nearly 1,400 companies will participate, utilizing an exhibition area of up to 80,000 square meters, marking a significant scale for the event.
25
Mar
Nvidia taps France’s Pasqal in quantum push to fast-track practical applications
At the first-ever Quantum Day at GTC 2025, held on March 20, Nvidia CEO Jensen Huang highlighted how quantum computing could dramatically enhance AI supercomputers. He pointed to its promise of accelerating breakthroughs in drug development and materials research and urged global experts to collaborate on the future of quantum technology and applications.
25
Mar
Japanese PCB maker Meiko to join satellite supply chain, challenging Taiwan’s dominance
Japan’s Meiko is set to become the third supplier in the low-Earth orbit satellite market by 2025, challenging the dominance of Taiwanese manufacturers Compeq and Unitech as geopolitical tensions drive supply chain diversification.
25
Mar
Nvidia expands ASIC footprint through MediaTek NVLink deal
MediaTek announced at this year’s GTC conference that it will deepen its partnership with Nvidia by integrating NVLink IP into its ASIC services. Industry sources suggest this partnership boosts NVLink’s market influence amid speculation about Nvidia entering the ASIC market.
25
Mar
Chinese researchers develop solid-state 193nm DUV laser targeting advanced chipmaking
Researchers at the Chinese Academy of Sciences (CAS) have developed a solid-state deep ultraviolet (DUV) laser that emits 193nm light in lab conditions—a wavelength critical for semiconductor lithography. Although still in the early research phase and not ready for commercial applications, its emergence has been viewed as a potential challenger to the excimer laser systems currently used in chip production.
25
Mar
Will Intel’s new CEO pull the trigger on spinoff?
Intel’s foundry business appears headed for a potential spinoff under newly appointed CEO Lip-Bu Tan, according to comments from semiconductor industry analyst Eric Chen, who is now serving as a partner of Cornucopia Capital. The struggling chipmaker, which reported a US$13.4 billion loss in its foundry division last year, is likely to separate its manufacturing operations from its product business as Tan pursues a strategy markedly different from his predecessors.
25
Mar
Taiwan foundry revenues to go down in 1Q25 before rebound in 2Q25; mature nodes to face price competition from China, says DIGITIMES
The combined revenue of Taiwan’s major wafer foundry houses is anticipated to hit US$27.71 billion in the first quarter of 2025, a sequential decline of 5.8%. However, as AI/HPC chip demand continues to be strong and consumer electronics inventory is being gradually replenished, revenue in the second quarter is expected to rebound 5.7% quarterly to US$29.3 billion, according to DIGITIMES’ quarterly report covering Taiwan’s wafer foundry industry.
25
Mar
European Commission probes Chinese subsidies behind BYD’s US$4.3B Hungary EV plant
The European Commission has opened a preliminary investigation into whether Chinese electric vehicle (EV) giant BYD received unfair government subsidies for its planned factory in Hungary—highlighting rising trade and political tensions between Brussels and Beijing.