消息称苹果iPhone14组件供应商已经出货
6月28日消息，据行业媒体DigiTimes报道，苹果供应商已开始为iPhone 14机型发货，预计这些机型将照常在9月推出。该报告可能指的是在未来几个月内将组件运往富士康等制造商，以进行iPhone 14系列的最终组装。
28
Jun
28
Jun
CLAP成功为OLED显示器开发相位差膜
专门开发有机半导体、显示器材料和零部件的韩国公司CLAP在6月28日宣布，该公司成功地为OLED显示器所用的相位差膜进行了本地化。
28
Jun
JBD宣布量产高性能红光Micro LED微显示器
近日，Micro LED微显示器领导制造商上海显耀显示科技有限公司（Jade Bird Display，以下简称 “JBD”）取得重大技术突破， 实现了50万尼特级超高亮度红光Micro LED微显示器的量产。
28
Jun
28
Jun
浙江百亿液晶面板项目“停摆” 原因调查
近日，有消息传出，浙江百亿液晶面板项目已经“停摆”，且项目实控人已被拘接受调查。为此，科创板日报于6月27日进入项目基地进行了调查。
28
Jun
广东省季华新型显示装备有限公司揭牌成立
6月26日，旨在提升我国新型显示产业自主创新能力的广东“璀璨行动”在佛山启动，40余家项目参与单位签订了合作协议，广东省季华新型显示装备有限公司揭牌成立。
28
Jun
Lenovo G27qc-30 is unveiled with a 27″ QHD curved VA display and a 165Hz refresh rate
The Lenovo G27qc-30 has been unveiled today as the curved sibling of the Lenovo G27q-30. They both feature 27-inch QHD VA displays with up to 165Hz refresh rates, 350 nits of typical brightness. However, there are minor differences in addition to the 1500R curvature of the new model. It also has a 4000:1 static contrast instead of a 3000:1 one, 122% sRGB and 91% DCI-P3 coverage. The 8-bit LUT is…
27
Jun
SEA roundup: Malaysia seeks more investment from semiconductor players
Tech startups are reportedly laying off workers as global economic uncertainties loom. Meanwhile Malaysia is seeking more investment to upgrade its semiconductor prodution and Thailand has seen car production fall sharply this year due to persistent chip crunch.
27
Jun
Competition poised to heat up in 3-horse race for 3/2nm processes
Foundry market competitions among TSMC, Samsung Electronics and Intel will heat up significantly as they are advancing to 3/2nm manufacturing nodes, and it seems that Samsung will face an uphill battle in the three-horse race, judging from their respective potential customer support for their next-generation process technologies, according to industry observers.
27
Jun
Chipmakers focus on heat dissipation in manufacturing process upgrades
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive, HPC, industrial and network chip segments, according to industry sources.