27
Aug
26
Aug
YMTC targets global NAND lead by 2027 as parent seeks US$5 billion IPO
Yangtze Memory Technologies (YMTC) is aiming to become the world’s largest NAND flash supplier by the end of 2027, setting an aggressive target as its parent prepares a nearly US$5 billion Shanghai listing to fund production upgrades and research.
26
Aug
Silicon Optronics advances high-end BSI products as memory shortage splits CIS demand
CMOS image sensor (CIS) manufacturer Silicon Optronics (SOI) president Bob Chen pointed out during an earnings call on August 25 that artificial intelligence (AI) demand has caused price hikes and shortages for memory since the fourth quarter of 2025. With market supply remaining tight and showing no signs of easing, this has led to a clear polarization in the security camera market. Going forward, the company will continue accelerating its development of higher-end back-side illumination (BSI) products to improve its overall product mix.
26
Aug
Malaysia mobility sector embraces Chinese firms as investment catalyst
Malaysia’s mobility industry is welcoming a larger role for Chinese automakers, with investment, technology exchange and supplier development emerging as key themes at GATE 2026. Malaysia Automotive, Robotics and IoT Institute (MARii) chairman Aminar Rashid bin Salleh said the growing presence of Chinese car brands is adding new momentum to the country’s mobility sector.
26
Aug
Southeast Asia mobility shifts put GATE 2026 in focus
The 2026 Global Automotive and Technology Expo (GATE 2026) will take place August 26-28 at the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur, as Southeast Asia’s auto market enters a new phase of slower overall growth but faster EV adoption.
26
Aug
TSMC packaging shift could boost AMD CoWoS share and trim Nvidia’s allocation
Morgan Stanley said TSMC’s advanced packaging allocation is expected to shift in 2027, as processor demand tied to agentic AI lifts AMD’s CoWoS usage and reduces Nvidia’s share. The report, cited by Wccftech, attributed the shift to TSMC’s rising capacity amid expanding industry-wide demand.
26
Aug
Record mid-2026 growth for WUS Printed Circuit and China’s pivot to ultra-high-layer PCBs
The global hardware supply chain is undergoing a structural transformation, driven by an unprecedented surge in artificial intelligence infrastructure investment. “This shift has brought unprecedented market opportunities to the industry,” noted WUS Printed Circuit (Kunshan). The major supplier of high-end printed circuit boards (PCBs) reported explosive growth in its mid-2026 financial results.
26
Aug
Bioteq lifts Yilan plant output as it shifts production and eyes 2027 growth
Bioteq is increasing output at its Yilan Science Park plant, a move that could affect supply chains across Asia, Africa, and the Americas. As the company shifts more products and upgrades equipment, it is aiming to improve efficiency, manage geopolitics, and support demand in developing markets.
26
Aug
Driving the future: Malaysia’s strategic automotive evolution at GATE 2026
The Global Automotive and Technology Expo 2026 (GATE 2026) officially opened on August 26, spotlighting efforts to deepen Malaysia’s local supply chain, accelerate technology adoption and position the country as ASEAN’s leading automotive and smart mobility hub. Cooperation between China, Malaysia and other ASEAN countries drew particular attention at the event.
26
Aug
Hot Chips 2026: Nvidia pushes deeper into server CPUs with Vera
Nvidia used Hot Chips 2026 to disclose more details about Vera, its next-generation data-center CPU, as the company pushes deeper into the standalone server processor market long dominated by Intel and AMD.