Intel plans to abandon in-house glass substrate development, shift to external procurement

According to Computerbase, under the leadership of new CEO Lip-Bu Tan, Intel might no longer push forward with in-house R&D of glass substrates but instead turn to purchasing ready-made solutions from specialized suppliers. This move is expected to help Intel accelerate the launch of viable products while diversifying risks and maintaining flexibility to switch suppliers.

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Details of the US-China trade agreement remain unclear, with no consensus on rare earths and chip controls

On June 26, 2025, US President Donald Trump announced that the US had signed a trade agreement with China on June 25, which was also confirmed by China’s Ministry of Commerce. From the talks in Geneva on May 11 to negotiations in London on June 10, followed by Trump’s recent announcement, what exactly have the two countries agreed upon?

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Samsung completes development of 1c DRAM, paving way for HBM4 rollout

Samsung Electronics has successfully developed its sixth-generation DRAM, known as 1c DRAM, built using a 10nm class process. The product has received internal Production Readiness Approval (PRA), signaling it has met key quality and performance benchmarks and is now in the final phase before mass production. The milestone brings Samsung one step closer to its goal of mass-producing HBM4, or fourth-generation high-bandwidth memory, in the second half of 2025.

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Apple AI falls from grace: Claude in, engineers out, strategy in flux

Apple is reportedly reevaluating its artificial intelligence (AI) roadmap, exploring the integration of external large language models (LLMs) from OpenAI and Anthropic to power future versions of Siri. According to Bloomberg and Reuters, this shift away from Apple’s proprietary “Foundation Models” signals broader uncertainty in the company’s AI strategy.

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