Competing with leading players, Cheng Mei Instrument Technology recently delivered the first CoPoS measurement and inspection equipment to the ASE Group, aiming to break KLA Corporation’s near-monopoly in the equipment market. Cheng Mei Chairman Tony Tsai stated that in recent years, the company has been aggressively entering the advanced packaging field. He estimates that in 2025, measurement and inspection equipment in the semiconductor sector will account for roughly 60–70% of revenue, with 2026 expected to exceed 70%.