SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai’s Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.
SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai’s Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.
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