With traditional OSAT providers, IDMs and foundries like Intel, TSMC and ASE heading into advanced packaging technologies to tap the growing high performance computing market, concerns about sustainability have started to drive industry trends. According to Jun He, TSMC’s vice president of quality and reliability, the narrowing linewidth and growing difficulty to extend Moore’s Law makes advanced packaging, system integration and material innovation increasingly important to sustain the momentum of increasing transistor count per unit area. Meanwhile, Min-Te Chen, a director at TSMC who also chairs SEMI Taiwan Materials Committee, observed that the global sustainability development is reaching a new milestone, so the current shared goal of the semiconductor industry is to align the push for advanced process technology with sustainability goals, and that can be done through innovation in materials.