Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new entrant, CoWoP (Chip-on-Wafer-on-Platform PCB), has emerged as a potential disruptor to TSMC’s mainstream CoWoS packaging solution. Some industry observers believe CoWoP could reshape the PCB supply chain and even challenge CoPoS (Chip-on-Panel-on-Substrate), which has long been considered the most likely successor to CoWoS.