Automotive chips and power devices continue to see uneven supplies, and Taiwan’s leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics and Onsemi all badly need backend equipment to support their chips production. According to Chan Pin Chong, senior vice president and general manager of products and solutions at Kulicke & Soffa (K&S), a leading vendor of advanced packaging and other semiconductor equipment, the gap between capacity demand and equipment supply has already been narrowing.