As demand for high-speed transmission in AI advanced packaging surges, IC substrate major Unimicron Technology said that high-end ABF substrates required for AI applications are strongly leading a market recovery, gradually breaking free from the post-pandemic overexpansion downturn. Despite the rapid market recovery for IC substrates, the short-term problem of T-glass fiberglass shortages remains. Although improvement is expected in the second half of 2026, high-end ABF substrate supply is likely to remain tight until the end of the year, and nearly all customers are facing limitations in sourcing fiberglass.