ficonTEC, a maker of optoelectronic automation assembly and test equipment, has announced a strategic partnership with Hermes Testing Solutions Inc. (HTSI) to support Taiwan’s rapidly expanding co-packaged optics (CPO) ecosystem. The collaboration will initially focus on the INS-2 test platform, advancing ficonTEC’s double-sided wafer-level testing architecture — with electrical testing from above and optical testing from below — towards commercialisation and scaled deployment.