Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major memory makers over stable mass production and supply. Industry sources say the next wave of high-capacity HBM will be decided by one core issue: how effectively vendors solve heat dissipation.
HBM4 battle shifts to cooling as hybrid bonding slips
20
Jul