Latest News and Trends

High-end IC testing demand to stay robust in 2H22

Outsourced semiconductor assembly and testing (OSAT) vendors continue to enjoy strong order pull-in for high-end chips used in automotive, high-performance computing (HPC), and server device applications, which will fill up related bumping, flip chip ball grid array (FC-BGA), land grid array (LGA), and other advanced packaging capacities through the second half of 2022, according to industry sources.