Semiconductor testing and analysis service provider Hongkang held its annual shareholders’ meeting on June 18. Chairperson Hsieh Yung-fen said the company has begun investing in a silicon photonics wafer-and-chip optoelectronic analysis platform in anticipation of growing demand for silicon photonics. The first system is expected to be installed before August 2026, followed by a second and third system by the end of 2026 and early 2027, respectively.