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Infineon signed MoU with Stellantis, seeking 30% of global SiC market share by the end of decade

Infineon Technologies and Stellantis have signed a non-binding Memorandum of Understanding (MoU) as the first step towards a potential multi-year supply cooperation for silicon carbide (SiC) semiconductors. Accordingly, Infineon would reserve manufacturing capacities and deliver the SiC chips to the direct Tier 1 suppliers of Stellantis in the second half of the decade, to be used in Stellantis’ EVs.