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Infinera secures US$93 million CHIPS Act funding to expand photonic chip production and packaging

The US Department of Commerce has partnered with Infinera through the CHIPS and Science Act, signing a non-binding memorandum to provide up to US$93 million in funding. This investment aims to boost Infinera’s semiconductor manufacturing and advanced packaging operations in California and Pennsylvania. The initiative, focused on national security and enhancing communications infrastructure, seeks to create new jobs while fortifying the US supply chain, supporting long-term economic resilience and growth.