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Innolux’s transformation journey: from display panel to advanced semiconductor packaging

Innolux Corporation, a leading display panel manufacturer, is undergoing a significant transformation as it ventures into the semiconductor field with its Fan-Out Panel Level Packaging (FOPLP) technology. The company is closing its generation 5.5 TFT-LCD plant and has garnered attention due to its collaboration with TSMC on FOPLP development and potential interest from Micron Technology in acquiring the aforementioned plant.