Latest News and Trends

Intel pushes large-area AI packaging to close foundry gap

  • Posted by author-avatar
20 Mar
Intel is reportedly preparing large-area AI chip packaging to strengthen its foundry business and challenge TSMC and Samsung Electronics.
Newer The 2026 Hisense CanvasTV are launched in the U.S. under the Hisense S7SG series
Back to list
Older Lumotive creates world’s first 2D photonic beamforming chip