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Samsung establishes HBM development team as first major change under new DS division head

Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics’ Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth memory (HBM) and advanced packaging (AVP) through strategic organizational restructuring and reforms. According to ZDNet Korea, the DS division’s recent reorganization primarily focuses on HBM, AVP, and the Equipment Technology Research Institute.