In the high-stakes race to supply memory for the next generation of artificial intelligence, Samsung Electronics is under mounting pressure to deliver its 12-layer HBM3E chips to Nvidia by the end of 2025. But as its self-imposed deadline approaches, uncertainty lingers over whether Samsung can meet the rigorous performance standards set by its most critical customer.
Samsung races to deliver HBM3E memory to Nvidia but faces certification hurdles
28
May