Jeong Gi-tae, vice president of Samsung Electronics’ foundry business unit, recently revealed the development roadmap for the company’s wafer foundry technology at an industry-academic exchange conference in South Korea. This includes new technologies such as silicon capacitors, demonstrating that Samsung’s technology is not falling behind competitors like TSMC and expressing high optimism about future improvements.
Samsung reveals silicon capacitors and 3.5D packaging roadmap
25
Oct