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SDI partners with Infineon to develop lead frame technology for AI and third-gen semiconductors

Taiwan-based lead frame manufacturer SDI announced it has signed a right of first offer (ROFO) agreement with Infineon Technologies to jointly advance the development of lead frame technology for artificial intelligence (AI) accelerators and expand into third-generation semiconductor applications, including silicon carbide (SiC) and gallium nitride (GaN), targeting AI processors used in hyperscale data centers.