Taiwan-based lead frame manufacturer SDI announced it has signed a right of first offer (ROFO) agreement with Infineon Technologies to jointly advance the development of lead frame technology for artificial intelligence (AI) accelerators and expand into third-generation semiconductor applications, including silicon carbide (SiC) and gallium nitride (GaN), targeting AI processors used in hyperscale data centers.
SDI partners with Infineon to develop lead frame technology for AI and third-gen semiconductors
10
Nov