Samsung Electro-Mechanics (Semco) has officially shut down its smartphone motherboard (HDI) factory in Kunshan, China, as part of a broader strategy to pivot toward higher-value business segments. The company confirmed that it completed the liquidation of the Kunshan facility by the end of 2024, effectively ending its presence in the smartphone HDI market.
Semco exits smartphone HDI market with closure of Kunshan plant
25
Feb