AI data center demand is accelerating the shift to faster optical interconnects, putting transmission speed, power efficiency, and packaging integration at the center of next-generation optical communications. Taiwan’s Ligitek Electronics and Liverage Technology are working with the Industrial Technology Research Institute (ITRI) and Dutch photonic chip packaging specialist Phix on a cross-border silicon photonics program targeting phased milestones of 1.6T DR8 by the end of 2026 and 3.2T product development by the end of 2027.