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TSMC cautious on High NA EUV as ASML unveils its US$400M chipmaking machine

Kevin Zhang, Deputy Co-Chief Operating Officer at TSMC, recently reiterated the company’s cautious approach toward adopting High NA EUV lithography tools, emphasizing that TSMC is “in no rush” to bring the advanced technology into high-volume production. His remarks have reignited industry speculation around ASML’s multi-billion-dollar next-generation lithography platform.