Latest News and Trends

TSMC CoWoS shortage drives SK Hynix-Intel 2.5D push

12 May
TSMC’s tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI accelerators.
Newer ViewSonic XG275D1‑4K is launched with a 4K Fast IPS display and 330Hz dual-mode
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Older Aurotek posts record first-quarter revenue and profit as robot demand surges