TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC vice president and co-chair of the SEMI Silicon Photonics Industry Alliance (SiPhIA), K.C. Hsu, said that over the past 3-6 months, the industry has gradually reached a consensus on the technology roadmap and direction for the next 3-5 years. SiPh has also been designated by the government as a key policy focus in this new era.