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TSMC poised to sustain lead with integrated advanced processes in next decade

While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with big investments by major players including TSMC, Samsung, Intel, ASE Technology and Amkor in the next decade. And TSMC is in pole position to outrace peers further through integrating its advanced manufacturing process nodes and 3D Fabric family of stacking and packaging technologies, according to industry observers.